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eInfochips joins TSMC Design Center Alliance for Semiconductor Innovation



eInfochips, an Arrow Electronics company has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform (OIP).

The TSMC DCA program focuses on chip-implementation services and system-level design solutions to help lower design barriers for customers adopting TSMC technology.

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The company brings extensive experience and a track record of successful tape-outs in TSMC’s leading-edge process technologies to this Alliance.

Speaking on the development, Mangesh Kulkarni, VP & General Manager of Semiconductor practice, eInfochips said, “Our collaboration with the TSMC DCA program signifies a pivotal moment for eInfochips. It reflects our deep expertise and positions us to offer an expanded range of design and testing services, utilizing TSMC’s latest technological advancements.”

Commenting on the development, Dan Kochpatcharin, Head of the Design Infrastructure Management Division, TSMC said, “We are pleased to welcome eInfochips to the TSMC Design Center Alliance, and we are confident that eInfochip’s expertise will greatly assist our mutual customers in achieving first-time silicon success”

“TSMC is committed to collaborating with our OIP ecosystem, including eInfochips, to empower designers in achieving their design goals and quickly bringing their innovation to market,” Kochpatcharin further added.

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Krishna Mali
Krishna Mali
Founder & Group Editor of TechGraph.

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