Cricketing legend Sachin Tendulkar-backed semiconductor manufacturer RRP Electronics has signed a strategic partnership with US-based Deca Technologies, Inc. to enhance its wafer-level packaging capabilities.
“As a part of the partnership, RRP Electronics—renowned for its expertise in assembling and testing semiconductor components—will integrate Deca’s cutting-edge Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes. This will elevate the company’s ability to deliver high-performance semiconductor solutions to customers worldwide,” the press release said.
Speaking on the partnership, Rajendra K. Chodankar, Chairman and CEO of RRP Electronics, said, “We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to create a fully automated, world-class infrastructure. This partnership will take semiconductor packaging in India to new heights.”
“We aim to complete our qualification tests by August 2025 and foresee revenue exceeding USD 30 million (about ₹260 crore) in just the second year of operations, with exponential growth in the years to come,” he added.
Further commenting on the strategic development, Tim Olson, Founder & CEO of Deca Technologies said, “We are thrilled to be part of India’s ambitious semiconductor growth story. RRP Electronics’ vision, expertise, and determination make it the perfect partner to drive innovation in semiconductor packaging. This collaboration will accelerate their ambitious plans and strengthen India’s position in the global semiconductor value chain.”
In September 2024, RRP Electronics inaugurated a state-of-the-art manufacturing facility, integrating next-generation semiconductor packaging technology. The facility is expected to create around 4,000 jobs, contributing to the local economy and strengthening Maharashtra’s position as a key hub in the global semiconductor industry.