Taiwan-based leading semiconductors company, MediaTek has announced its partnership with ‘realme’ to launch its first MediaTek Dimensity 810 processor-powered 5G smartphone in India.
The innovative new chip, launched earlier this month, redefines mainstream 5G smartphone experiences with flagship-class technology. MediaTek Dimensity 810 processor builds in a great performance, premium displays, and supreme cameras for any situation, all in a leading 6nm chip design that raises the bar for 5G smartphone battery life.
realme’s new 5G smartphone will be the first-ever smartphone to be powered by the MediaTek Dimensity 810 processor. realme is also India’s first smartphone brand to launch multiple MediaTek 5G processors, including MediaTek Dimensity 800U with realme X7 5G; MediaTek Dimensity 700 with realme 8 5G, and MediaTek Dimensity 1200 with realme X7 Max 5G.
“MediaTek is taking consistent steps to offer the benefits of 5G to consumers across demographics, seamlessly and optimally. Our MediaTek Dimensity family of chipsets, offering SoCs ranging from mass market to flagship categories, is an extension of our vision and the latest MediaTek Dimensity 810 is primed to offer superlative 5G features and experiences to the mainstream market. Ensuring boosted performance, intelligent displays, and brilliant images, the new chip will redefine user experience and deliver advanced 5G features and capabilities to next-gen smartphones. With this latest collaboration with our long-term OEM realme, we are keen on bringing MediaTek Dimensity 810 powered smartphones to Indian customers who are looking for an incredible all-around smartphone experience, be it for incredible processor speeds, snappier app response, longer battery life, more FPS in games or incredible camera and videography features” said Anku Jain, Managing Director, MediaTek India.
MediaTek Dimensity 810 provides Arm Cortex-A76 CPU speeds up to 2.4GHz, premium camera features including artistic AI-color in collaboration with ArcSoft, and advanced noise reduction techniques for superb low-light photography.
Featuring TSMC’s leading 6nm production process, previously only available in flagship-class 5G phones, the MediaTek Dimensity 810 is one of the most power-efficient chips available, giving brands new opportunities to create the slimmest and lightest 5G smartphones ever.
Powered by MediaTek HyperEngine 2.0’s Intelligent Resource Management Engine offering enhanced power efficiency for even longer gameplay and supporting 2CC CA covering up to 120MHz of the spectrum, including mixed duplex FDD+TDD connections, MediaTek Dimensity 810 SoC offers higher average speeds and a seamless handover between two 5G connection areas across a coverage layer, where users receive over 30% greater throughput layer coverage than without CA.
Commenting on the partnership, Madhav Sheth, Vice President – realme and CEO, realme India and Europe said, “As a 5G Leader and the world’s fastest-growing smartphone brand, we always believe that our users deserve the best and everyone deserves to experience 5G. We have a long-standing association with MediaTek in bringing some industry-first 5G processors for unparalleled performance.”
“We are excited to announce that realme is collaborating with MediaTek to bring in the World’s first Dimensity 810 5G chipset enabled smartphone. This pushes the boundaries of innovation and re-affirms our commitment to make consumers future-ready. We are eager to provide our fans with incredible features and performance with cutting-edge 5G-enabled smartphones,” Sheth added.
